description these high intensity white led lamps are based on ingan material technology. a blue led die is coated by phosphor to produce white. the typical resulting color is described by the coordinates x = 0.31, y = 0.31 using the 1931 cie chromaticity diagram. these t-1 ? lamps are untinted, diffused, and incorporate precise optics which produce well-defined spatial radiation patterns at specific viewing cone angle. caution: devices are class 1 esd sensitive. please observe appropriate precautions during handling and processing. refer to application note an-1142 for additional details. hlmp-cw46, hlmp-cw47. hlmp-cw76, hlmp-cw77 t-1 ? (5mm) extra bright precision optical performance white led lamps. data sheet features ? well defined spatial radiation pattern ? high luminous white emission ? viewing angle: 50 and 70. ? standoff or non-standoff leads ? superior resistance to moisture applications ? electronic signs and signals ? small area illumination ? legend backlighting ? general purpose indicators benefit ? reduced power consumption, higher reliability, and increased optical/mechanical design flexibility compared to incandescent bulbs and other alternative white light sources.
2 part numbering system package dimensions package dimension b package dimension a 1.14 ?0.20 (0.045 ?0.008) 5.80 ?0.20 (0.228 ?0.008) 5.00 ?0.20 (0.197 ?0.008) 31.60 (1.244) min. 0.70 (0.028) max. 1.00 (0.039) min. 8.71 ?0.20 (0.343 ?0.008) 2.54 ?0.38 (0.100 ?0.015) 0.50 ?0.10 (0.020 ?0.004) sq. typ. cathode lead 2.35 (0.093) max. cathode flat notes: 1. all dimensions are in millimeters /inches. 2. epoxy meniscus may extend about 1mm (0.040") down the leads. 3. if heat-sinking application is required, the terminal for heat sink is anode. 1.14 ?0.20 (0.045 ?0.008) 5.80 ?0.20 (0.228 ?0.008) 5.00 ?0.20 (0.197 ?0.008) 31.60 (1.244) min. 0.70 (0.028) max. 1.00 (0.039) min. 8.71 ?0.20 (0.343 ?0.008) 2.54 ?0.38 (0.100 ?0.015) 0.50 ?0.10 (0.020 ?0.004) sq. typ. cathode lead cathode flat 1.50 ?0.15 (0.059 ?0.006) dimension h mechanical option 00: bulk dd: ammo pack straight leads color bin options 0: full color bin distribution b: color bin 2 & 3 only maximum intensity bin 0: no maximum intensity bin limit others: refer to device selection guide minimum intensity bin refer to device selection guide viewing angle and standoff option 46: 50? without standoff 47: 50? with standoff 76: 70? without standoff 77: 70? with standoff h l m p - -xxxxxxx cw dimension h: 50: 11.98 0.25mm (0.4715 0.01 inches) 70: 11.09 0.25mm (0.4365 0.01 inches)
3 device selection guide notes: 1. tolerance for luminous intensity measurement is +/- 15% 2. the luminous intensity is measured on the mechanical axis of the lamp package. 3. the optical axis is closely aligned with the package mechanical axis. 4. 2 1/2 is the off-axis angle where the luminous intensity is ? the on axis intensity 5. part numbers in bold are recommended for new designs. part number typ i cal vie win g an gl e, 2 ? (degree) intensity (mcd) at 20 ma standoff package dimension min. max. hlmp-cw46-ps0xx 50 880 2500 no a hlmp-cw46-qr0xx 50 1150 1900 no a hlmp-cw46-qrbxx 50 1150 1900 no a hlmp-cw46-ru0xx 50 1500 4200 no a hlmp-cw46-st0xx 50 1900 3200 no a hlmp-cw46-stbxx 50 1900 3200 no a hlmp-cw47-ps0xx 50 880 2500 yes b HLMP-CW47-QR0XX 50 1150 1900 yes b hlmp-cw47-qrbxx 50 1150 1900 yes b hlmp-cw47-ru0xx 50 1500 4200 yes b hlmp-cw47-st0xx 50 1900 3200 yes b hlmp-cw47-stbxx 50 1900 3200 yes b hlmp-cw76-nr0xx 70 680 1900 no a hlmp-cw76-pq0xx 70 880 1500 no a hlmp-cw76-pqbxx 70 880 1500 no a hlmp-cw76-qt0xx 70 1150 3200 no a hlmp-cw76-rs0xx 70 1500 2500 no a hlmp-cw76-rsbxx 70 1500 2500 no a hlmp-cw77-nr0xx 70 680 1900 yes b hlmp-cw77-pq0xx 70 880 1500 yes b hlmp-cw77-pqbxx 70 880 1500 yes b hlmp-cw77-qt0xx 70 1150 3200 yes b hlmp-cw77-rs0xx 70 1500 2500 yes b hlmp-cw77-rsbxx 70 1500 2500 yes b
4 0 5 10 15 20 25 30 35 0 20 40 60 80 100 ambient temperature - ?c i f - forward current - ma r j-a = 585?c/w r j-a = 780?c/w figure 3. relative intensity versus dc forward current figure 1. relative intensity vs. wavelength figure 2. forward current vs. ambient temperature electrical/optical characteristics t a = 25 o c notes: 1. the reverse voltage of the product is equivalent to the forward voltage of the protective chip at i r = 10 a 2. the chromaticity coordinates are derived from the cie 1931 chromaticity diagram and represent the perceived color of the devi ce. parameters symbol min typ max units test condition forward voltage v f 3.2 4.0 v i f = 20 ma reverse voltage [1] v r 5.0 v i r = 10 a thermal resistance r j-pin 240 o c/w led junction to anode lead chromaticity coordinates [2] x y 0.31 0.31 i f = 20 ma capacitance c 70 v f =0, f=1mhz 0.0 0.2 0.4 0.6 0.8 1.0 380 480 580 680 780 wavelength - nm relative luminous intensity 0 0.3 0.6 0.9 1.2 1.5 0102030 forward current - ma relative luminous intensity notes: 1. derate linearly as shown in figure 2. 2. duty factor 10%, frequency 1khz absolute maximum rating at t a = 25 o c parameters value unit dc forward current [1] 30 ma peak pulsed forward current [2] 100 ma power dissipation 105 mw led junction temperature 110 o c operating temperature range -40 to +85 o c storage temperature range -40 to +100 o c
5 intensity bin limit table figure 7. spatial radiation pattern for cw7x bin intensity (mcd) at 20 ma min max n680 880 p 880 1150 q 1150 1500 r 1500 1900 s 1900 2500 t 2500 3200 u 3200 4200 figure 4. chromaticity shift vs. current *note: (x,y) values @ 20ma reference to (0,0) figure 5. forward current vs. forward voltage figure 6. spatial radiation pattern for cw4x 0 5 10 15 20 25 30 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 v f - forward voltage - volts i f - forward current - ma -0.010 -0.005 0.000 0.005 0.010 0.015 0.020 0.025 -0.005 0.000 0.005 0.010 0.015 x-coordinates y-coordinates 30ma 20ma 10ma 5ma 1ma 0 0.5 1 -90 -60 -30 0 30 60 90 angular displacement (?) relative luminous intensity 0 0.5 1 -90 -60 -30 0 30 60 90 angular displacement (?) relative luminous intensity tolerance for each bin limit is 15%
6 color bin limit table note: 1. bin categories are established for classification of products. products may not be available in all bin categories. please contact your avago technologies representative for information on currently available bins. color bin limits with respect to cie 1931 chromaticity diagram rank limits (chromaticity coordinates) 1 x 0.330 0.330 0.356 0.361 y 0.360 0.318 0.351 0.385 2 x 0.287 0.296 0.330 0.330 y 0.295 0.276 0.318 0.339 3 x 0.264 0.280 0.296 0.283 y 0.267 0.248 0.276 0.305 4 x 0.283 0.287 0.330 0.330 y 0.305 0.295 0.339 0.360 0.40 0.35 0.30 0.25 0.20 0.26 0.30 0.34 0.38 y-coordinate x-coordinate 3 2 4 1 black body curve tolerance for each bin limit is 0.01
7 wave soldering manual solder dipping pre-heat temperature 105 ? max. ? preheat time 30 sec max ? peak temperature 250 c max. 260 c max. dwell time 3 sec max. 5 sec max bottom side of pc board top side of pc board note: allow for boards to be sufficiently cooled before exerting mechanical force. conveyor speed = 1.83 m/min (6 ft/min) preheat setting = 150 c (100 c pcb) solder wave temperature = 245 c air knife air temperature = 390 c air knife distance = 1.91 mm (0.25 in.) air knife angle = 40 solder: sn63; flux: rma 250 200 150 fluxing turbulent wave preheat time - seconds temperature - ?c 100 50 30 0 10 20 30 40 50 60 70 80 90 100 laminar wave hot air knife led component ead size diagonal plated through hole diameter 0.457 x 0.457mm (0.018 x 0.018inch) 0.646 mm (0.025 inch) 0.976 to 1.078 mm (0.038 to 0.042 inch) 0.508 x 0.508mm (0.020 x 0.020inch) 0.718 mm (0.028 inch) 1.049 to 1.150mm (0.041 to 0.045 inch) precautions: lead forming: ? the leads of an led lamp may be preformed or cut to length prior to insertion and soldering into pc board. ? if lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to led package. otherwise, cut the leads of led to length after soldering process at room temperature. the solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the led chip die attach and wirebond. ? it is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. soldering condition: ? care must be taken during pcb assembly and soldering process to prevent damage to led component. ? the closest led is allowed to solder on board is 1.59mm below the body (encapsulant epoxy) for those parts without standoff. ? recommended soldering condition: recommended wave soldering profile note: refer to application note an1027 for more information on soldering led components. ? wave soldering parameter must be set and maintain according to recommended temperature and dwell time in the solder wave. customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. ? if necessary, use fixture to hold the led component in proper orientation with respect to the pcb during soldering process. ? proper handling is imperative to avoid excessive thermal stresses to led components when heated. therefore, the soldered pcb must be allowed to cool to room temperature, 25c before handling. ? special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. ? recommended pc board plated through holes size for led component leads.
for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies, limited in the united states and other countrie s. data subject to change. copyright ? 2006 avago technologies pte. all rights reserved. 5989-1431en - may 29, 2006
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